Haisheng Rong’s research is focused on delivering ‘high bandwidth density and energy-efficient optical I/O networks enabled by silicon photonics technology’.

While Rong believes that ‘low-cost manufacturing and co-packaging of electronic and photonic chips’ are a challenge in that regard, Intel Labs did announce this summer that it had demonstrated an eight-wavelength distributed feedback (DFB) laser array that was fully integrated on a silicon wafer and was designed and fabricated on Intel's 300 mm hybrid silicon photonics platform. At the time, Rong said:

‘This new research demonstrates that it’s possible to achieve well-matched output power with uniform and densely spaced wavelengths. Most importantly, this can be done using existing manufacturing and process controls … ensuring a clear path to volume production of the next-generation co-packaged optics and optical compute interconnect at scale.’

https://spie.org/profile/Haisheng.Rong-32022?SSO=1

Haisheng Rong’s research is focused on delivering ‘high bandwidth density and energy-efficient optical I/O networks enabled by silicon photonics technology’.

While Rong believes that ‘low-cost manufacturing and co-packaging of electronic and photonic chips’ are a challenge in that regard, Intel Labs did announce this summer that it had demonstrated an eight-wavelength distributed feedback (DFB) laser array that was fully integrated on a silicon wafer and was designed and fabricated on Intel's 300 mm hybrid silicon photonics platform. At the time, Rong said:

‘This new research demonstrates that it’s possible to achieve well-matched output power with uniform and densely spaced wavelengths. Most importantly, this can be done using existing manufacturing and process controls … ensuring a clear path to volume production of the next-generation co-packaged optics and optical compute interconnect at scale.’

https://spie.org/profile/Haisheng.Rong-32022?SSO=1

Haisheng Rong’s research is focused on delivering ‘high bandwidth density and energy-efficient optical I/O networks enabled by silicon photonics technology’.

While Rong believes that ‘low-cost manufacturing and co-packaging of electronic and photonic chips’ are a challenge in that regard, Intel Labs did announce this summer that it had demonstrated an eight-wavelength distributed feedback (DFB) laser array that was fully integrated on a silicon wafer and was designed and fabricated on Intel's 300 mm hybrid silicon photonics platform. At the time, Rong said:

‘This new research demonstrates that it’s possible to achieve well-matched output power with uniform and densely spaced wavelengths. Most importantly, this can be done using existing manufacturing and process controls … ensuring a clear path to volume production of the next-generation co-packaged optics and optical compute interconnect at scale.’

https://spie.org/profile/Haisheng.Rong-32022?SSO=1

Haisheng Rong’s research is focused on delivering ‘high bandwidth density and energy-efficient optical I/O networks enabled by silicon photonics technology’.

While Rong believes that ‘low-cost manufacturing and co-packaging of electronic and photonic chips’ are a challenge in that regard, Intel Labs did announce this summer that it had demonstrated an eight-wavelength distributed feedback (DFB) laser array that was fully integrated on a silicon wafer and was designed and fabricated on Intel's 300 mm hybrid silicon photonics platform. At the time, Rong said:

‘This new research demonstrates that it’s possible to achieve well-matched output power with uniform and densely spaced wavelengths. Most importantly, this can be done using existing manufacturing and process controls … ensuring a clear path to volume production of the next-generation co-packaged optics and optical compute interconnect at scale.’

https://spie.org/profile/Haisheng.Rong-32022?SSO=1